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wafer edge review
Products - Wafer Edge Review Device

  • This test equipment reviews the edge quality of silicon wafers. The device processes wafers with a diameter of 300mm and a thickness of approx. 775µm.
  • There is no need for removing the wafers from the cassette. Thus, the device minimizes the risk of contamination and demolition of wafers.
  • For futher information, please use the contact form Kontaktformular or send an e-mail