Products - Wafer Edge Review Device
- This test equipment reviews the edge quality of silicon wafers. The device processes wafers with a diameter of 300mm and a thickness of approx. 775µm.
- There is no need for removing the wafers from the cassette. Thus, the device minimizes the risk of contamination and demolition of wafers.
- For futher information, please use the contact form Kontaktformular or send an e-mail